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Hybrid assemblies and multichip modules by Fred W. Kear

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Published by M. Dekker in New York .
Written in English

Subjects:

  • Hybrid integrated circuits -- Design and construction.,
  • Multichip modules (Microelectronics) -- Design and construction.

Book details:

Edition Notes

Includes bibliographical references (p. 265-267) and index.

StatementFred W. Kear.
SeriesManufacturing engineering and materials processing ;, 38
Classifications
LC ClassificationsTK7874 .K38 1993
The Physical Object
Paginationx, 278 p. :
Number of Pages278
ID Numbers
Open LibraryOL1729057M
ISBN 100824784669
LC Control Number92033369

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Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.   Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability by Michael Pecht (Author) ISBN Cited by: Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service. Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this books microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service.

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on » Book ~ 9GHOX3M9DT Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability (Hardback) By Michael Pecht John Wiley & Sons Inc, United States, Hardback. Condition: New. Language: English. Brand new Book. multichip modules (MCMs) []. The main goal of using hybrid circuits (apart from PTF), is saving space, volume and weight compared to ordinary printed circuit boards. However, we can also achieve superior high frequency properties and very high reliability. This makes hybrid circuits suitable for demanding military systems, space applications. Multichip modules (MCM) are basically extensions of hybrid microcircuits, the differences being in their higher degree of density and improved electrical performance. In general, an MCM is defined as a microcircuit that has a silicon-to-substrate density greater than 30%. Three basic MCM types, defined according to the process used in fabricating the interconnect substrate, have been developed. Michael Pecht, et al.“Integrated Circuit, Hybrid, and Multichip Module Packaging: A focus on Reliability”, Wiley Interscience, New York, NY (). Google Scholar [4].

A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). Buy the Hardcover Book Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability by Michael Pecht at , Canada's largest bookstore. Free shipping and pickup in store on eligible orders. Multi-Chip Module (MCM) has the same basic construction as Chip-On-Board but with some significant differences. Adding multiple integrated circuits allow us to combine more circuit functions into one multi-chip module, which further reduces circuit size and mass. Integrated Circuit Hybrid, and Multichip Module Package Design Guidelines [Books and Reports] Article (PDF Available) in IEEE Power Engineering Review 15(1) February with Reads.